The Future of Seamless Audio According to Qualcomm

An exclusive interview with Dino Bekis, Qualcomm's Vice President and General Manager, Wearables & Mixed Signal Solutions Business Unit, where he shares fascinating insights into the company's roadmap and future developments, leveraging the best of Bluetooth and Wi-Fi in wireless earbuds and headphones into a seamless, high-quality audio experience. We also learn about Qualcomm's unique vision for its latest generation Snapdragon Sound platforms, and XPAN technology, allowing wireless hi-res audio without bandwidth constraints or compromising battery life.

A Celebration of the Art of the Possible. CES 2025 was extremely successful. Even with the impression of fewer people because of the show being even more dispersed. In this first impressions report we discuss how Edge-AI (on-device) is transforming what is possible in audio processing. And of course there was MagSafe and Qi2. USB4. Bluetooth LE Audio. Auracast. Wireless Multichannel. And much more. This is necessarily a brief first impressions editorial to follow up on a very intense edition of CES, where the business-to-business aspects of the show have intensified as predicted.

Ceva announced the first complete multi-protocol wireless connectivity platform that supports Bluetooth High Data Throughput (HDT). This next generation technology meets the pressing need for Bluetooth devices looking to support streaming of even larger media at higher data rates. The new Ceva-Waves Links200 IP platform is designed to dramatically enhance wireless audio capabilities and support advanced applications like 7.1 audio systems.