All items tagged with artificial intelligence (259)

DTS Tackles Dialogue Intelligibility Problems Directly on TVs

September 9, 2024 by Joao Martins

DTS Tackles Dialogue Intelligibility Problems Directly on TVs

One of the audio technology highlights at IFA 2024 was the announcement by DTS of its new Clear Dialogue on-device solution for TV OEMs. Leveraging its vast experience and IP portfolio with audio processing and enhancement technologies, from content production and distribution, all the way to the home, the Xperi subsidiary was able to apply AI-based audio processing to deliver a solution that identifies, separates and enhances spoken dialogue for TV audio to improve user experience.

Signia Unveils Active Pro IX Earbud-Style Hearing Aids with Realtime Conversation Enhancement

September 6, 2024 by Joao Martins

Signia Unveils Active Pro IX Earbud-Style Hearing Aids with Realtime Conversation Enhancement

Powered by Signia’s Integrated Xperience (IX) technology, the new Signia Active Pro IX design combines the advanced capabilities of full prescription hearing aids with the form-factor and features of consumer earbuds. According to the Danish brand, these prescription-grade hearing aid devices will appeal to those already familiar with the possibilities of cutting-edge earbuds, bringing much needed assistance to even more people.

Dolphin Design Announces Partnership with Fraunhofer IIS to Enhance Power Management in Edge AI

August 27, 2024 by audioXpress Staff

Dolphin Design Announces Partnership with Fraunhofer IIS to Enhance Power Management in Edge AI

Dolphin Design announced a new strategic partnership with the Fraunhofer Institute for Integrated Circuits IIS, a research Institute and member of the European Union's PREVAIL project consortium. This collaboration aims to push the boundaries of power management in next-generation edge AI (Artificial Intelligence) technologies. Dolphin's Power Management IP platform accelerates and secures the design of energy-efficient SoCs.

xMEMS Introduces 1mm-Thin Active Micro-Cooling "Fan on a Chip"

August 20, 2024 by Joao Martins

xMEMS Introduces 1mm-Thin Active Micro-Cooling "Fan on a Chip"

xMEMS Labs announced an innovation in a completely new direction for the company. The new xMEMS XMC-2400 µCooling chip is the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation AI solutions. xMEMS recently revamped its website to reflect the new strategic directions for the company, now with piezoMEMS microspeakers and the actively controlled acoustic vent transducers DynamicVent segments complemented by the new cooling products category.

Google Introduces AI-Assisted Pixel Buds Pro 2 Earbuds

August 13, 2024 by Joao Martins

Google Introduces AI-Assisted Pixel Buds Pro 2 Earbuds

Tuesday, August 13 was scheduled as Pixel day, when Google promoted its ninth "Made by Google" event to unveil an extensive range of hardware devices, including new Pixel 9 phones, the Pixel 9 Pro Fold, Pixel Watch 3 and Pixel Buds Pro 2. The smartphones are what one would expect at this time, a best of all the Android smartphones available until now. The Pixel Buds Pro 2 are Google's best attempt in the category with better ANC and battery life.

SoundHound AI Acquires Amelia to Expand Reach In Conversational AI and Enterprise Applications

August 9, 2024 by audioXpress Staff

SoundHound AI Acquires Amelia to Expand Reach In Conversational AI and Enterprise Applications

SoundHound AI announced the acquisition of Amelia, a leading enterprise AI software company with experience in voice interfaces and context-aware, natural language conversational capabilities for customer service applications. The business combination positions SoundHound AI as a strong provider of voice and conversational generative AI, with reach across multiple industries – including retail, financial services, healthcare, automotive, smart devices, restaurants, and more.

Phonak Unveils AI-Powered Real-Time Speech Separation in Noisy Environments

August 6, 2024 by Joao Martins

Phonak Unveils AI-Powered Real-Time Speech Separation in Noisy Environments

Phonak, a Sonova brand, launched a new family of hearing aids based on its latest Infinio platform. Part of the Infinio family with several Bluetooth-enabled models that still don't support LE Audio, is the Audéo Sphere Infinio, said to be the world's first hearing aid with a dedicated real-time AI chip for speech-from-noise separation. Powered by a new Phonak ERA processor, and a dedicated NPU, the new Audéo Sphere Infinio hearing-aids are able to enhance speech understanding from any direction.

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

July 31, 2024 by Joao Martins

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

Particle, a company from San Francisco focused on edge-to-cloud connectivity and platforms, has launched Tachyon, its first Qualcomm Snapdragon-powered single-board computer (SBC), comprising a powerful NPU for AI/ML workloads, built-in high-bandwidth cellular 5G and Wi-Fi 6E connectivity, and a Linux-powered Ubuntu operating system. The board is now available for pre-order on Kickstarter starting at $149.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

Sparse Artificial Intelligence MCU from Femtosense and ABOV Semiconductor Delivers AI-Based Voice Processing On-Device

July 17, 2024 by Joao Martins

Sparse Artificial Intelligence MCU from Femtosense and ABOV Semiconductor Delivers AI-Based Voice Processing On-Device

Femtosense, in partnership with ABOV Semiconductor in South Korea, has launched the AI-ADAM-100, an artificial intelligence microcontroller unit (AI MCU) built on sparse AI technology to enable on-device AI features such as voice-based control in home appliances and other products. According to the Silicon Valley startup, the new AI-ADAM-100 AI MCU is a low-power, low-cost option for on-device language processing and voice-cleanup capabilities.

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