SonicEdge MEMS Ultrasound Speaker-In-Chip: Next Gen MEMS for TWS Earbuds and Hearing Aids

Mike Klasco writes all about the cutting-edge SonicEdge MEMS Ultrasound Speaker-In-Chip. A next-gen MEMS solution for TWS earbuds, hearing aids, and hearables. Entering production in 2023, this unique ultrasonic shutter MEMS-based speaker system represents a decade's work in a unique topology. The core of the design is one or more apertures driven by the ultrasonic carrier signal and one or more movable and over-sized obstruction elements that are configured to modulate the ultrasonic carrier signal (think of a shutter) thereby generating audio.