All items tagged with MEMS (40)

xMEMS Introduces 1mm-Thin Active Micro-Cooling "Fan on a Chip"

August 20, 2024 by Joao Martins

xMEMS Introduces 1mm-Thin Active Micro-Cooling "Fan on a Chip"

xMEMS Labs announced an innovation in a completely new direction for the company. The new xMEMS XMC-2400 µCooling chip is the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation AI solutions. xMEMS recently revamped its website to reflect the new strategic directions for the company, now with piezoMEMS microspeakers and the actively controlled acoustic vent transducers DynamicVent segments complemented by the new cooling products category.

Practical T&M: Measuring MEMS Microspeakers

July 17, 2024 by Steve Temme and Michael Ricci

Practical T&M: Measuring MEMS Microspeakers

MEMS microspeakers are a completely new class of product with its unique challenges. MEMS drivers are now commercially available and seeing fast evolution and adoption in true wireless stereo (TWS) earbuds and in-ear monitors (IEM). With the emergence of these small form-factor transducers comes the need to address how to measure its performance and ensure product quality, even before its integration in finished products.

Fortemedia Unveils ForteSound Coil-Based MEMS Speaker Product Family

April 22, 2024 by Joao Martins

Fortemedia Unveils ForteSound Coil-Based MEMS Speaker Product Family

Fortemedia, a Taiwan based supplier of MEMS microphones to some of the world's leading smartphone and laptop manufacturers, has now announced the launch of its latest innovation, a coil-based MEMS speaker range. Its first product is the ForteSound FS01, which the company says extends the audio frequency response to 80kHz, with extended SPL Response and Low THD, delivering a new type of high-reliability, low-power audio transducer.

R&D Stories: How Optical Technology Enables a Generational Shift in MEMS Microphone Performance

December 13, 2023 by Jakob Vennerød and Kieran Harney

R&D Stories: How Optical Technology Enables a Generational Shift in MEMS Microphone Performance

The article summarizes the evolution of MEMS microphone technology and describes the benefits of optical microphones over conventional solutions. This is a crucial reading to understand how the first generation of optical MEMS microphones have smashed the limits of SNR and dynamic range of miniature microphones, with 80dBA SNR (14dBA noise floor), 132dB dynamic range, 24-bit digital output and all with ultra-low power consumption.

xMEMS Achieves Extended Bass Response, Making ANC Applications Possible From a Single MEMS Driver

November 14, 2023 by Joao Martins

xMEMS Achieves Extended Bass Response, Making ANC Applications Possible From a Single MEMS Driver

The new Cypress MEMS speaker from xMEMS Labs achieves 40X louder bass response on a single monolithic, miniaturized device, achieving well above the 130dB SPL at low frequencies, required for ANC implementations on TWS earbuds. The new xMEMS Cypress achieves this groundbreaking performance by using ultrasound technology. The new development will be demonstrated at CES 2024 by appointment only, with mass production scheduled for late-2024.

October 10, 2023 by audioXpress Staff

MEMS Industry Expert Anthony Minervini Joins sensiBel

As it gets closer to commercialization, the optical MEMS microphone company from Norway, continues to expand its business and leadership team. sensiBel confirmed that it hired industry-heavyweight Anthony Minervini to the sensiBel development team. Anthony has been in the MEMS industry for 23 years and for the last 8 years has served as the microphone packaging technology architect for the acoustics group at Apple, following previous experiences with Knowles and Invensense (TDK), and Analog Devices.

Simulation Techniques: SonicEdge Ultrasound Speaker - Modeling and Application

September 27, 2023 by René Christensen

Simulation Techniques: SonicEdge Ultrasound Speaker - Modeling and Application

The SonicEdge transducer - a cutting-edge microspeaker based on a unique MEMS technology that generates sound using active ultrasound modulation - introduces a completely new class of devices that can deliver constant volume velocity across audio frequencies and beyond. The article details how to model the transducer in lumped-element and finite-element acoustic simulations and how to tailor a desired SPL response using acoustic features. As originally published in audioXpress, August 2023.

USound and Luxshare-ICT Deliver Dual-Driver Audio Module for TWS

August 25, 2023 by Joao Martins

USound and Luxshare-ICT Deliver Dual-Driver Audio Module for TWS

Luxshare-ICT, one of the largest manufacturers and supplier for global consumer electronics brands, and Austrian MEMS pioneer USound have developed Gemini, an innovative hybrid audio module that offers numerous advantages through its 2-way audio technology combining a MEMS and a dynamic driver coaxially aligned. The solution not only enhances sound quality but allows effective active noise cancellation (ANC) applications with MEMS drivers.

Active Acoustics, Noise Cancellation, and Product Development in audioXpress August 2023

July 14, 2023 by audioXpress Staff

Active Acoustics, Noise Cancellation, and Product Development in audioXpress August 2023

As audioXpress August 2023 focus on Acoustics, read the report on Electroacoustic Enhancement and Active Acoustics. René Christensen details the model and application of the SonicEdge Ultrasound Speaker. Philipp Paul Klose writes about Noise Cancellation in Automotive Audio. And we visit the Western Electric Tube Factory in Rossville, GA. Read the AXPONA 2023 show report, how to Design a True Midrange Driver, and how to build an Instrumentation Amplifier-Based Preamplifier Line Stage.

Nanusens Announces That It Can Now Create ASICs With Embedded Sensors

May 26, 2023 by audioXpress Staff

Nanusens Announces That It Can Now Create ASICs With Embedded Sensors

Nanusens has announced that it has successfully created a fully digital circuit design to measure the capacitance of its nanosensors. This means that both the sensor structure and its detection circuitry can be made at the same time within a chip using standard CMOS processes on whatever process node is required. As a result, ASICs can now be made with several different sensors embedded within them, helping to expand MEMS applications in hearables.

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