All items tagged with DSP (390)

Antelope Audio Announces Zen Go Synergy Core Bus-Powered Audio Interface with DSP

January 27, 2021 by audioXpress Staff

Antelope Audio Announces Zen Go Synergy Core Bus-Powered Audio Interface with DSP

During NAMM Believe in Music week, Antelope Audio announced Zen Go Synergy Core, its first USB-C bus-powered, truly portable (4x8) audio interface, available as a powerful DSP-based desktop design powered by the same Synergy Core onboard effects processing platform found in the manufacturer’s top-tier audio interfaces with which it shares its technology, and yet attractively priced in the sub-$500 USD/€500 EUR market segment.

KEF Launches New KC62 Subwoofer with Uni-Core Technology

January 21, 2021 by audioXpress Staff

KEF Launches New KC62 Subwoofer with Uni-Core Technology

As previously teased, KEF announced the launch of the new KC62 powered subwoofer with three innovative technologies that successfully prioritize design and sound in equal measure. Combining the brand's technologies and skills, KEF's engineers have developed a brand new approach to subwoofer performance, allowing maximum bass in a minimum space. Using KC62's force-canceling and Uni-Core technologies, KEF surpasses traditional expectations of what a subwoofer can achieve based on its size.

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

January 13, 2021 by audioXpress Staff

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

CEVA introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). The new, lower power, SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio. They are also automotive-ready with high-precision floating-point capability.

Dirac Teams Up With OSM Group to Offer Spatial Audio Solutions for Next-Generation Headphones

January 12, 2021 by audioXpress Staff

Dirac Teams Up With OSM Group to Offer Spatial Audio Solutions for Next-Generation Headphones

Swedish digital audio pioneer Dirac and OSM Group, a global designer, developer and manufacturer have entered into an agreement to include Dirac’s industry-leading spatial audio solution in headphones created by OSM for its global portfolio of electronics customers. Under the terms of the agreement, OSM Group will license the Dirac spatial audio solution for integration into headphones that the company develops for leading brands around the world.

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

January 7, 2021 by audioXpress Staff

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

Syntiant Corp., the AI for edge devices chip technology company from Irvine, California, announced the availability of its latest Syntiant NDP120 Neural Decision Processor (NDP), a new generation of special purpose chips for audio and sensor processing for always-on applications in battery-powered devices. The low-power Syntiant Core 2 technology in the NDP120 processor delivers 25x the tensor throughput of the core technology found in earlier Syntiant NDP devices that are currently shipping in high volumes.

CEVA Establishes Partnership with DARPA for Technology Innovation

January 5, 2021 by audioXpress Staff

CEVA Establishes Partnership with DARPA for Technology Innovation

CEVA announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs. The commercial partnership, as part of the DARPA Toolbox initiative, establishes an access framework under which DARPA organizations can access all of CEVA’s commercially available IPs, tools and support to expedite their programs. This provides DARPA researchers with access to CEVA’s portfolio of wireless connectivity and smart sensing IPs.

Lawo Unveils New mc²36 Compact Mixing Console and Next-Generation Audio Processing Core

January 4, 2021 by audioXpress Staff

Lawo Unveils New mc²36 Compact Mixing Console and Next-Generation Audio Processing Core

Showing what a digital audio mixing console in the IP age can be, German company Lawo recently introduced its new mc²36, with the most compact footprint and the most powerful feature set ever. The new console expands upon Lawo's successful mc²-series control surfaces, and redefines what a compact production console can deliver, from theater, to broadcast audio applications. The all-in-one mc²36 doubles the number of DSP channels, both at 48 kHz and 96 kHz, with all industry-standard audio inputs and outputs built-in, and native IP connectivity at its center.

Fresh From the Bench: The Puffin Phono DSP by Parks Audio

December 17, 2020 by Mike Harkins

Fresh From the Bench: The Puffin Phono DSP by Parks Audio

In this article, Mike Harkins reviews the versatile Puffin Phono DSP by Parks Audio. For those of you who are not familiar with Parks Audio, this company was founded by Shannon Parks, who has also contributed fantastic articles published by audioXpress. After experimenting with several other products, Parks Audio has achieved notoriety for its phono stage Puffin, which adds a programmable DSP and is able to be updated and improved constantly with simple firmware updates. A new approach that truly takes the concept of a phono stage to a different level. This article was originally published in audioXpress, December 2020.

Renkus-Heinz Stretches Iconyx Compact Series Steerable Columns to Bring Intelligible Sound to Larger Spaces

December 7, 2020 by Joao Martins

Renkus-Heinz Stretches Iconyx Compact Series Steerable Columns to Bring Intelligible Sound to Larger Spaces

California-based loudspeaker manufacturer Renkus-Heinz continues undeterred in its effort to lead the industry towards networked, digitally steerable, and fully integrated Reference Point Array sound reinforcement systems. The company now announced two new products in its latest Iconyx Compact Series: the Iconyx Compact 36/3-RN and the 48/3-RN. The two tallest solutions bring the benefits of the Iconyx family into an impressively compact and architecturally friendly package.

Alango Technologies Introduces VoiceDefender Advanced 4-Mic Voice Processing Technology

December 2, 2020 by Joao Martins

Alango Technologies Introduces VoiceDefender Advanced 4-Mic Voice Processing Technology

Alango VoiceDefender is a new advanced voice enhancement signal processing solution, ready to be used by developers and manufacturers in new on-ear and over-ear headphone designs without the need of an ugly boom mic. VoiceDefender enables noise-free voice communication for on-ear/over ear headphones virtually eliminating dominant noise sources and highlighting voice and speech signals, effectively taking augmented audio to a whole new level.

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