All items tagged with Bluetooth SIG (46)

Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting

March 19, 2020 by audioXpress Staff

Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting

Cinemas, gamers and the hard of hearing could all benefit from Bluetooth 5.2, according to the latest "Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast" report from SAR Insight & Consulting. Bluetooth will continue to be a popular and flexible way to connect devices, thanks in part to the technology being refreshed to remain relevant to component manufacturers and consumers, says SAR Insight & Consulting.

Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2

February 19, 2020 by audioXpress Staff

Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2

The Rohde & Schwarz CMW platform of Bluetooth testers already support the new Bluetooth Low Energy (LE) version 5.2 power control test routines. At the moment of release, these are the only T&M instruments that measure all specified RF tests up to Bluetooth LE 5.0 over the air, and are ready to support also the new LE Audio specification. This unique solution has already been submitted to the Bluetooth SIG for the specification of a new Bluetooth LE test mode.

The True Potential of True Wireless Earbuds

January 30, 2020 by Vincent Nallatamby

The True Potential of True Wireless Earbuds

This article from Vincent Nallatamby, CEO of Tempow, a Paris-based startup discusses the potential of Bluetooth LE Audio to improve true wireless stereo applications. Tempow is a research and design lab focused on pushing the limits of Bluetooth technology. The company's first product, the Tempow Audio Profile (TAP) is an updated Bluetooth protocol allowing any Bluetooth chip to stream audio on multiple Bluetooth audio outputs simultaneously. The company also released a Bluetooth Software Stack for LE Audio, the next generation of Bluetooth audio.

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

January 8, 2020 by audioXpress Staff

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

Nordic Semiconductor announced it has launched an LE Audio Evaluation Platform in partnership with San Diego, CA-based Bluetooth Low Energy (Bluetooth LE) stack developer, Packetcraft. The LE Audio solution demonstrates the benefits of High-Quality Wireless LE Audio and is designed to support the new LE Audio specifications that are expected to be released by the Bluetooth Special Interest Group (SIG) during the first half of 2020.

Bluetooth SIG Unveils LE Audio, the Next Generation of Bluetooth Audio

January 7, 2020 by audioXpress Staff

Bluetooth SIG Unveils LE Audio, the Next Generation of Bluetooth Audio

At CES 2020, the Bluetooth Special Interest Group (SIG) announced the upcoming release of LE Audio, the next generation of Bluetooth audio. Two years on the making, Bluetooth LE Audio will enhance the performance of wireless audio, add support for hearing aids, and introduce Audio Sharing, a new use case with the potential to once again change the way we experience audio and connect with the world around us as Bluetooth did when it cut the cord 20 years ago to create the wireless audio market.

CEVA Announces Availability of RivieraWaves Bluetooth 5.1 IP

January 30, 2019 by audioXpress Staff

CEVA Announces Availability of RivieraWaves Bluetooth 5.1 IP

CEVA announced the general release of its RivieraWaves Bluetooth 5.1 IP and multiple license agreements already signed with leading semiconductor companies. Supporting the headline new feature of Direction Finding via Angle of Arrival (AoA) and Angle of Departure (AoD) for enhanced location services, the RW-Bluetooth 5.1 IP is available in both Bluetooth Dual Mode and Bluetooth Low Energy flavors.

Bluetooth Special Interest Group Introduces Location Services with Bluetooth 5.1 Specification

January 29, 2019 by audioXpress Staff

Bluetooth Special Interest Group Introduces Location Services with Bluetooth 5.1 Specification

The Bluetooth Special Interest Group (SIG) announced a new direction finding feature that holds the potential to significantly enhance the performance of Bluetooth location services solutions, down to centimeter-level location accuracy. The new feature, included in version 5.1 of the Bluetooth Core Specification, allows devices to determine the direction of a Bluetooth signal, thereby enabling the development of Bluetooth proximity solutions that can understand device direction as well as Bluetooth positioning systems.

Peter Liu from Bose and Ron Wong from Cypress Semiconductors Appointed to Bluetooth SIG Board of Directors

July 11, 2018 by audioXpress Staff

Peter Liu from Bose and Ron Wong from Cypress Semiconductors Appointed to Bluetooth SIG Board of Directors

The Bluetooth Special Interest Group (SIG) announced that Peter Liu, Architect of Wearable Systems at Bose, and Ron Wong, Director, Product Marketing in the Microcontroller & Connectivity Division of Cypress Semiconductor will be joining the board of directors of the Bluetooth SIG as Associate Member Directors. The Bluetooth SIG Board of Directors is responsible for the governance of the organization and plays a vital role in driving the expansion of Bluetooth technology to address the needs of a growing number of consumer and commercial markets.

Bluetooth SIG Adds Mesh Networking Capability to Standard BLE Ecosystem

July 19, 2017 by audioXpress Staff

Bluetooth SIG Adds Mesh Networking Capability to Standard BLE Ecosystem

The Bluetooth Special Interest Group (SIG) announced that the wireless connectivity global standard now supports mesh networking. This enables many-to-many (m:m) device communications and is optimized for creating large-scale device networks, ideally suited for building automation, sensor networks and smart home solutions where tens, hundreds, or thousands of devices need to reliably and securely communicate with one another.

Bluetooth 5 Audio Update - An Interview with Mark Powell, Executive Director, Bluetooth SIG

March 23, 2017 by Joao Martins

Bluetooth 5 Audio Update - An Interview with Mark Powell, Executive Director, Bluetooth SIG

Ahead of the Bluetooth World 2017 meeting (March 28-29 2017), which will bring together more than 1,000 developers, executives, and start-ups on a busy exhibition floor to promote Bluetooth development and applications, we thought it would be appropriate to share part of the interview we had with Mark Powell, Executive Director, Bluetooth SIG, at CES 2017, where we discussed the Bluetooth 5 roadmap.

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