All items in category Industry News
Qualcomm 2017 State of Play Report Now Available
by audioXpress Staff

Qualcomm 2017 State of Play Report Now Available

Qualcomm released its 2017 State of Play report. The report based on a survey of 4,000 adult smartphone users in the US and UK conducted by OnePoll, Ltd., helps identify current consumer attitudes and purchase drivers for wireless headphones and speakers. This annual report highlights consumer demand for convenience and quality from personal audio devices.
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Acoustic Geometry Launches New Website
by audioXpress Staff

Acoustic Geometry Launches New Website

Acoustic Geometry, a company offering acoustic products for a wide range of professional audio, residential and business applications, announces the launch of its new website (www.acousticgeometry.com). One of the main features of the new site is the Product Selector, according to three easy-to-choose categories: Home, Business and Professional. Additionally, the new site incorporates a Room Explorer feature that gives easy access to products in a specific room setting.
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Dirac Research to Make its CEDIA Debut with Presentation on the Future of Audio Room Correction Technology
by audioXpress Staff

Dirac Research to Make its CEDIA Debut with Presentation on the Future of Audio Room Correction Technology

First-time exhibitor Dirac Research will host a 90-minute presentation on recent developments in room correction technology and unveil its newest product innovation – Mobile Dirac Live at CEDIA 2017 in San Diego, CA. The Swedish company, responding to growing demand from industry professionals and potential partners, will explain the latest advancements in room correction technologies and recent developments in the field.
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ANSYS 18.2 Release Enhances Simulation Speed and Accuracy
by audioXpress Staff

ANSYS 18.2 Release Enhances Simulation Speed and Accuracy

ANSYS continues to expand upon its products and platform, and deliver on the Pervasive Engineering Simulation vision, with its latest release of ANSYS 18.2. This update brings increased levels of accuracy, speed and ease-of-use – spurring more engineers to use simulation across every stage of the product lifecycle to design cutting-edge products more efficiently and economically.
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Earphones and Headphones Market to Surpass USD $25bn by 2024
by audioXpress Staff

Earphones and Headphones Market to Surpass USD $25bn by 2024

According to a new research report by Global Market Insights, Inc., the earphone and headphone market share is set to exceed USD 18.2 billion by 2023 and to exceed $25bn by 2024. Advancements in wireless technologies and the rising adoption of portable devices such as smartphones, mobiles, laptops, and tablets will prominently drive earphones and headphones market size over the coming six years. Global shipments will grow at nearly 4% CAGR estimation, the market research firm predicts.
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European Imaging and Sound Association (EISA) Awards 2017-2018 in Audio Categories
by audioXpress Staff

European Imaging and Sound Association (EISA) Awards 2017-2018 in Audio Categories

The European Imaging and Sound Association (EISA) Awards 2017-2018 have been announced. Already listed at www.eisa.eu, the EISA Awards 2017-18 recognize performance and innovation in Consumer Electronics, including audio categories in hi-fidelity, home theater and mobile. This year the awards have a strong European flavor in the higher end home categories, with Japan and Asia in general dominating the home theater items. Exception for a US brand, JBL takes two awards in personal audio.
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DSP Group and LISNR Partner to Create Ultra-low Power Audio-Enabled Data Transmission Solution
by audioXpress Staff

DSP Group and LISNR Partner to Create Ultra-low Power Audio-Enabled Data Transmission Solution

Wireless communications chipset specialist, DSP Group and LISNR, a global provider of data-over-audio technology, developed the Audio-D, a solution that supports data-over-audio communication for any device with a speaker or microphone. This solution, based on DSP Group’s DBMD4 Voice SoC and LISNR technology, overcomes device-to-device hardware restraints regarding RF protocols. This enables always-on communication and high level of interoperability while consuming low power.
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Monster and Speak Music Debut “MonsterTalk” Family of Voice-Controlled Headphones
by audioXpress Staff

Monster and Speak Music Debut “MonsterTalk” Family of Voice-Controlled Headphones

Monster Products and Speak Music, the voice and AI driven personal music platform, announced the launch of the “MonsterTalk” Family of voice-powered premium headphones. While other headphone manufacturers have implemented voice-assistants that "talk" to users, Monster implemented a fully-featured voice recognition interface, allowing users to literally tell their headphones what music to play, ask for a particular song, artist, genre or playlist.
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Renowned Recording Engineer and Producer Leslie Ann Jones to Deliver Heyser Lecture “Paying Attention” at AES New York Convention
by Audio Engineering_Society

Renowned Recording Engineer and Producer Leslie Ann Jones to Deliver Heyser Lecture “Paying Attention” at AES New York Convention

The Audio Engineering Society has announced that the award-winning and highly renowned recording engineer and producer Leslie Ann Jones of Skywalker Sound will deliver the Heyser Memorial Lecture at the upcoming AES New York Convention, taking place October 18 to 21 at the Jacob Javits Center.
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NAMM Announces Expansion and Enhanced Experiences for NAMM Show 2018
by audioXpress Staff

NAMM Announces Expansion and Enhanced Experiences for NAMM Show 2018

The 2018 NAMM Show, the global crossroads of the music products, pro audio and sound, and event technology industries, will offer exhibitors and attendees the largest expanded campus in the show’s history when the doors open January 25-28, 2018 in Anaheim, California. The 2017 edition welcomed 7,000 brands and a record 1,779 exhibiting companies. The opening of the ACC North Hall, promises to make the NAMM Show 2018 even larger, and an enhanced show experience for all.
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