All items in category Industry News
The New York Audio Show is Back to Manhattan in 2017!
by audioXpress Staff

The New York Audio Show is Back to Manhattan in 2017!

The New York Audio Show 2017 will return to Manhattan, once again taking place at the luxurious Park Lane Hotel on Central Park South, one of New York’s most prestigious locations. Chester Group promotes a high quality audio show with some of the most prestigious high end audio brands, taking three classic floors on consecutive levels in the hotel, with spectacular views that overlook Central Park. Some of these rooms are amongst the largest available, allowing perfect demonstrations of the best in high end audio and home theatre.
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HARMAN International Joins the Wireless Speaker and Audio (WiSA) Association
by audioXpress Staff

HARMAN International Joins the Wireless Speaker and Audio (WiSA) Association

The Wireless Speaker and Audio (WiSA) Association, an industry group dedicated to bringing high resolution, wireless, multi-channel audio products to the home theater market, announced HARMAN International as its newest member. Will this signal a comeback for what it was a great technology proposition? It was successfully implemented and is still used by Bang & Olufsen and Klipsch, among other companies. And the audio industry certainly needs it.
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New Futuresource 2017 Worldwide Headphones Market Report
by audioXpress Staff

New Futuresource 2017 Worldwide Headphones Market Report

Futuresource Consulting continues to release consistent market research that provides guidance for any company in the consumer electronics space and specifically for the audio industry. In their latest 2017 Worldwide Headphones Report, Futuresource predicts further growth in global headphones aftermarket both in units shipped and average prices. The report predicts 4.1% growth to 362 million units in 2017, generating revenues worth $15.5 billion.
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Audio-over-IP, AES67 and more at the 143rd International AES Convention
by audioXpress Staff

Audio-over-IP, AES67 and more at the 143rd International AES Convention

With the recent publication of the new SMPTE ST 2110 suite of standards for real-time media transport over IP and the critical role of AES67 in defining the audio component of these, the 143rd International AES Convention in New York, co-located with the NAB Show New York 2017, will be an important moment for the audio industry to learn, engage, experiment and plan its future. The Audio Engineering society, the Media Networking Alliance, and other industry organizations will focus on education, education, education.
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Vesper Partners with Synaptics on Far-field Voice Interfaces for Amazon Alexa Voice Service
by audioXpress Staff

Vesper Partners with Synaptics on Far-field Voice Interfaces for Amazon Alexa Voice Service

Vesper, developer of the world’s most advanced piezoelectric acoustic sensors, announced a collaboration with Synaptics Incorporated, to improve developers’ ability to create ultra-durable, high-performance and highly stable voice interfaces for Amazon Alexa Voice Service (AVS) devices. Synaptics has selected Vesper piezoelectric MEMS microphones for its two- and four-microphone Amazon AVS development kits.
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Infineon High SNR MEMS Microphones Complement Amazon AVS Far-Field Development Kit from XMOS
by audioXpress Staff

Infineon High SNR MEMS Microphones Complement Amazon AVS Far-Field Development Kit from XMOS

XMOS' VocalFusion 4-Mic Dev Kit for Amazon Alexa Voice Service (AVS) for far-field applications integrates Infineon’s high SNR MEMS microphones to ensure highest performance and reliability, creating the first Amazon AVS development kit with a linear mic array for far-field applications. The 4-Mic Development Kit features crystal clear voice capturing even in noisy environments. This enables commands to be accurately captured from across the room for processing by the Alexa cloud-based speech recognition system.
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New COMSOL Multiphysics Software Unveiled with Major Acoustics Improvements
by audioXpress Staff

New COMSOL Multiphysics Software Unveiled with Major Acoustics Improvements

Once again, the 2017 COMSOL Conference in Boston brought together the COMSOL community. Attendees got a chance to test the latest features for COMSOL Multiphysics 5.3a and COMSOL Server, scheduled to be released in Q4 2017. New features include acoustics and acoustic-structure interactions based on a hybrid boundary element-finite element (BEM-FEM) method, impulse response for ray acoustics, magnetostatics, shape memory alloy (SMA) materials for structural analysis, and much more!
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Where Sound and Image Meet: AES New York 2017!
by Audio Engineering_Society

Where Sound and Image Meet: AES New York 2017!

The Audio Engineering Society New York 2017 convention will be co-located with the independent NAB Show New York 2017 event. In an adjacent exhibition hall, NAB Show New York exhibitors will be on hand with the latest video and distribution hardware and related sessions. Exhibits-Plus or All Access AES New York registration includes access to both exhibition halls. Naturally, the 143rd International AES Convention also features great content in audio for picture applications!
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Google Unveils New Home Smart Speakers and Wireless Pixel Buds
by audioXpress Staff

Google Unveils New Home Smart Speakers and Wireless Pixel Buds

Google is all-in in its determination to compete with Amazon, Apple and everyone else on the hardware front. On the same day, Google unveiled its second-generation family of consumer hardware products, including new Pixel 2 smartphones, Google Home Mini and Max smart speakers, an all-new Pixelbook tablet/laptop, Google Pixel Buds wireless earbuds, and more. No longer releasing "reference hardware" for its software ecosystem, Google is apparently determined to emulate Apple's successful strategy.
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XMOS Delivers Amazon Alexa Voice Service Development Kit with Linear Mic Array for Far-Field Voice Capture
by audioXpress Staff

XMOS Delivers Amazon Alexa Voice Service Development Kit with Linear Mic Array for Far-Field Voice Capture

XMOS announced its VocalFusion 4-Mic Dev Kit for Amazon Alexa Voice Service (AVS). A far-field linear mic array solution available, the XMOS kit is ideal for developers who want to integrate Alexa into smart panels, kitchen appliances, and other commercial and industrial electronics. Being a leading supplier of voice and audio solutions to the consumer electronics market, XMOS can combine its unique silicon architecture and software at the interface between voice processing, biometrics and artificial intelligence.
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