All items in category Electronics Corner
Langer EMV-Technik Announces PA 2522 Compact Preamplifier for Low Signal Measurements from 10MHz up to 22GHz
by audioXpress Staff

Langer EMV-Technik Announces PA 2522 Compact Preamplifier for Low Signal Measurements from 10MHz up to 22GHz

The new PA 2522 preamplifier from Langer EMV-Technik can be used to amplify weak measurement signals from near-field probes, connected to the 50Ω input of a spectrum analyzer or oscilloscope. It stands out because of its low noise behavior and a constantly high dynamic range over an extremely wide frequency range, from 10MHz to 22GHz. The preamplifier is powered by the included power adapter.
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Linear Systems Releases Low-Cost, Low-Noise LS844 JFET for High-Performance Applications
by audioXpress Staff

Linear Systems Releases Low-Cost, Low-Noise LS844 JFET for High-Performance Applications

Linear Systems announced the re-release of the low-noise, low-cost LS844 series dual JFET with immediate large-scale availability and large-volume pricing. The re-released LS844 is the latest evolution of a classic dual JFET developed and introduced by Linear Systems over 20 years ago. The company has refined the part’s design and fabrication processes to improve its low noise, matching and Common Mode Rejection Ratio qualities while retaining the linearity and other characteristics sought by audio and other circuit designers.
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Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC
by Cristina Costa

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

Dolphin Design, an advanced chip design company and leading specialist in Edge Computing and AI platforms, and Big Fish Semiconductor have entered into a long-term partnership. Big Fish Semiconductor’s U2 BLE 5.2 Audio AI SoC (TSMC 40nm uLP process ultra-low power audio chip), now in mass fabrication, is the first outcome of this partnership. The high-performance recording capabilities of the U2 BLE 5.2 Audio AI SoC are made possible by Dolphin Design's 24-bit delta-sigma audio ADC, which combines superior audio performance, small area and ultra-low power consumption.
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Laird Connectivity Launches New SOM that Delivers Powerful NXP Edge Processing with Wi-Fi and Bluetooth
by audioXpress Staff

Laird Connectivity Launches New SOM that Delivers Powerful NXP Edge Processing with Wi-Fi and Bluetooth

Laird Connectivity announced the new Summit SOM 8M Plus, a highly-integrated and comprehensive hardware and software solution that combines NXP multi-core applications processing with dual-band 2x2 Wi-Fi 5 and Bluetooth 5.3 connectivity. The new system-on-module (SOM) is Laird's most versatile, feature-rich, and secure wireless solution to date, truly perfect for serving as the core platform for advanced connected applications and audio/voice systems.
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Keysight Updates PathWave ADS Design and Simulation Software for Radio Frequency and Microwave Designers
by audioXpress Staff

Keysight Updates PathWave ADS Design and Simulation Software for Radio Frequency and Microwave Designers

Keysight Technologies has introduced the new PathWave Advanced Design System (ADS) 2023, an integrated design and simulation software that rapidly addresses increasing design complexity and higher frequencies in radio frequency (RF) and microwave applications. The updated design and simulation environment includes enhancements to electromagnetic (EM) simulation for circuit designers and streamlines integration of multi-technology circuit assembly and simulation into enterprise electronic design automation (EDA) design workflows.
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Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs
by audioXpress Staff

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

Texas Instruments expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of typical competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is priced to start as low as $0.79, making it affordable for engineers to add Bluetooth LE connectivity to more products.
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Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC
by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.
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New STMicroelectronics Smart Inertial Modules Bring AI To Remote Sensors
by Cristina Costa

New STMicroelectronics Smart Inertial Modules Bring AI To Remote Sensors

STMicroelectronics has introduced new inertial sensors that contain the intelligent sensor processing unit (ISPU) to power applications interacting with trained devices, allowing intelligence moving from “on” the edge to “in” the edge. The sensor's on-chip signal processing core, programmable with ST’s NanoEdge AI Studio, is ideal for machine-learning applications.
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Tektronix 2 Series Mixed Signal Oscilloscope Reimagines Performance and Portability
by Cristina Costa

Tektronix 2 Series Mixed Signal Oscilloscope Reimagines Performance and Portability

Tektronix unveiled the 2 Series Mixed Signal Oscilloscope (MSO), reimagining what is possible in test and measurement. The new 2 Series MSO can go seamlessly from the bench to the field and back, enabling workflows previously unimagined on a scope. It is the first portable oscilloscope to offer benchtop performance with a familiar Tektronix user interface. Weighing less than 1.8kgs and 38mm thin, the 2 Series MSO can fit into a small backpack, delivering unmatched performance and portability.
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CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection
by Cristina Costa

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

CEVA announced an expansion to its family of sensor fusion products with the introduction of the FSP201, a high-performance and low-power sensor hub MCU that delivers precise, accurate sensor fusion for motion tracking, heading and orientation detection. The FSP201 is ideal for consumer robotics and other emerging smart devices employing sensor fusion technologies, including XR glasses, 3D audio headsets and the wide range of 6-axis motion use cases across IoT and the metaverse.
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