All items tagged with product development (878)
Vesper Launches 2nd Generation Smart Piezoelectric Voice Accelerometer with ZeroPower Sensing
March 28, 2022 by Joao Martins

Vesper Launches 2nd Generation Smart Piezoelectric Voice Accelerometer with ZeroPower Sensing

Vesper continues to redefine its range of MEMS solutions for voice applications with the launch of the VA1210, Vesper’s 2nd generation analog piezoelectric smart voice accelerometer. The VA1210 offers higher sensitivity (+17 dB) and higher (+6 dB) SNR than the 1st generation VA1200 in voice pickup. Additionally, new intelligent features of Wake-on-Voice (WoV) and hardware voice activity detection (HVAD), introduced into the VA1210, enable a drastic improvement of voice quality True Wireless Stereo (TWS) earbuds.
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DSP Concepts Optimizes Audio Weaver for Analog Devices' SHARC+
March 24, 2022 by audioXpress Staff

DSP Concepts Optimizes Audio Weaver for Analog Devices' SHARC+

In a collaboration between DSP Concepts and Analog Devices, the performance of Audio Weaver Core runtime libraries has been optimized to take full advantage of the SHARC+ core and to leverage the powerful SHARC+ DSP FIR/IIR hardware accelerators. This optimization effort results in tangible benefits for developers of automotive audio systems and other products, when utilizing audio processors in the ADSP-2156x, ADSP-2159x, and ADSP-SC59x product families.
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GaN Systems Launches 300W Audio Boost Converter Switched Mode Power Supply
March 24, 2022 by audioXpress Staff

GaN Systems Launches 300W Audio Boost Converter Switched Mode Power Supply

GaN Systems announced the launch of its 300W Audio Boost Converter SMPS at the 37th annual Applied Power Electronics Conference (APEC) in Houston, Texas. The 300W reference design, targeted for automotive, marine, motorcycle, and a broad range of 12VDC input applications, features a complete turnkey platform solution that accelerates time-to-market, delivering improved audio quality and smaller, more streamlined audio systems.
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Sound Hub Denmark Establishes Partnership Agreement with Product Development Specialists Develco
March 24, 2022 by audioXpress Staff

Sound Hub Denmark Establishes Partnership Agreement with Product Development Specialists Develco

In the building that once was Bang & Olufsen's R&D department and acoustic test facilities, in Struer, Denmark, an ever-increasing number companies, entrepreneurs and researchers, are now working in all types of projects related to audio, sound and acoustics. Development house Develco was the latest company to join the vibrant hub that is now Sound Hub Denmark, expanding the already impressive partner network.
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Designed for Growth: Enabling Product Differentiation for TWS Development
March 23, 2022 by Raj Senguttuvan

Designed for Growth: Enabling Product Differentiation for TWS Development

Knowles announced the availability of a new development kit for true wireless stereo (TWS) earbuds, centered on the capabilities of its AISonic family of audio edge-AI processors and expanded by key partnerships in voice and audio processing algorithms for TWS products. This article details the opportunities for TWS development and helping manufacturers to differentiate their newest designs. This article was originally published in audioXpress, January 2022.
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Registration Now Open for AES 2022 Automotive Audio International Conference
March 15, 2022 by Audio Engineering_Society

Registration Now Open for AES 2022 Automotive Audio International Conference

The Audio Engineering Society has opened registration for the 2022 AES Automotive Audio International Conference, taking place in-person June 8 – 10 in Detroit, MI, at the historic Dearborn Inn. Advancements in automotive audio will take center stage at this year’s event through topical presentations, keynotes and attendee experiences. The AES Audio Product Education Institute promotes a dedicated three-day conference track and special events, reinforcing the general conference program.
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Magnachip Introduces High-Performance Synchronous Boost Converter for Battery-Powered Speakers
March 15, 2022 by Cristina Costa

Magnachip Introduces High-Performance Synchronous Boost Converter for Battery-Powered Speakers

Magnachip Semiconductor Corporation has released a synchronous boost converter with a new architecture of high-side and low-side switches that achieves a high efficiency to support for a variety of applications, including Bluetooth speakers and other battery-operated devices. The new synchronous boost converter is equipped with a fast transient response to reduce output voltage fluctuations in a short response time for stable power supply, making it ideally suited for devices which can exhibit significant current variations.
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DSP Concepts Launches TWS Toolkit Powered by Audio Weaver
March 4, 2022 by Joao Martins

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

DSP Concepts announced the availability of a new toolkit for True Wireless Stereo (TWS) earbuds powered by its Audio Weaver development platform. The toolkit features a reference design optimized to run on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary and manufacturer of low-power TWS Systems on Chip (SoCs). The development kit also includes a reference design with a fully operational earbud prototype designed by Knowles.
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ROHM Announces New 32bit D/A Converter IC for High-End Audio Products
March 2, 2022 by audioXpress Staff

ROHM Announces New 32bit D/A Converter IC for High-End Audio Products

ROHM Semiconductor announced that it has developed the new BD34352EKV digital-to-analog converter IC (DAC) and corresponding evaluation board (BD34352EKV-EVK-001), supporting playback of high-resolution audio sources in high-fidelity audio equipment. Complementing its latest MUS-IC BD34301EKV flagship DAC, the new product was designed to maximally extract and convert high resolution digital audio data to analog audio signals in new product designs.
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Qualcomm Redefines True Wireless with Two New Snapdragon Sound Platforms
February 28, 2022 by Joao Martins

Qualcomm Redefines True Wireless with Two New Snapdragon Sound Platforms

At Mobile World Congress 2022 in Barcelona, Qualcomm announced new options for brands and developers to offer the latest technologies in wireless audio. Qualcomm announced the latest S5 and S3 Sound Platforms with support for new Snapdragon Sound experiences, featuring lossless CD-quality streaming over Bluetooth, stereo recording, ultra-low latency sound with in-game chat, and adaptive active noise cancellation. Both new platforms already offer support for Bluetooth LE Audio.
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