All items tagged with product development (903)
New Cadence Virtuoso System Design Platform Provides Seamless Design Flow Between IC, Package and Board
June 1, 2017 by audioXpress Staff

New Cadence Virtuoso System Design Platform Provides Seamless Design Flow Between IC, Package and Board

Cadence Design Systems announced the Cadence Virtuoso System Design Platform, a formal, streamlined and automated co-design and verification flow between the Cadence Virtuoso platform and Allegro PCB design and Sigrity modelling technologies. This higher level of integration enables engineers to design concurrently across the chip, package and board, automating what has until now been a manual process to minimize errors and save time.
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Cypress Expands Wireless Connectivity Portfolio with New 802.11ac High-Performance Wi-Fi and Bluetooth Combo Solution Solution
May 30, 2017 by audioXpress Staff

Cypress Expands Wireless Connectivity Portfolio with New 802.11ac High-Performance Wi-Fi and Bluetooth Combo Solution Solution

During Computex 2017, Cypress Semiconductor announced a new wireless solution that delivers advanced coexistence combining 802.11ac high-performance Wi-Fi, Bluetooth and Bluetooth Low Energy (BLE). The new highly integrated Cypress CYW4373 solution incorporates a USB 2.0 hub that provides a common WLAN and Bluetooth interface. The combo solution seems to be ideal for connected audio systems.
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Frontier Silicon Announces Smart Audio Solution with Google Assistant
May 26, 2017 by audioXpress Staff

Frontier Silicon Announces Smart Audio Solution with Google Assistant

Frontier Silicon announced that its Smart Audio platform, Minuet, has been upgraded to include Google Assistant. Minuet already allows brands and manufacturers to develop smart audio devices with Chromecast built-in. With the addition of Google Assistant, users will be able to control their smart speakers via voice and use these speakers not only to play music but also to access Internet services, such as news, update personal schedules and control a wide range of smart home devices.
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Vesper VM1010 MEMS Microphones Save Over 10x More Battery for Voice-Activated Systems
May 25, 2017 by audioXpress Staff

Vesper VM1010 MEMS Microphones Save Over 10x More Battery for Voice-Activated Systems

Vesper has launched VM1010, the first wake-on-sound MEMS microphone that consumes nearly zero power — allowing consumers to voice-activate battery-powered smart speakers, smart earbuds and TV remotes without draining the battery. The inaugural member of Vesper’s ZeroPower Listening MEMS microphone product line, VM1010 is a tiny, ultra-rugged piezoelectric MEMS microphone.
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Microchip Introduces Fully-Certified Wi-Fi SDK with Apple HomeKit Support
May 23, 2017 by audioXpress Staff

Microchip Introduces Fully-Certified Wi-Fi SDK with Apple HomeKit Support

Microchip's new Wi-Fi SDK with Apple HomeKit support enables MFi licensees to create fast, low-power designs on the industry’s first hardware cryptography-enabled Wi-Fi-based development kit for HomeKit. The SDK leverages hardware-based calculations to create fast, low-power solutions, providing an optimized customer experience that dramatically reduces execution time for HomeKit commands and provides pairing speeds of less than one tenth of a second.
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Sensory’s Fusion of Face and Voice Biometric Recognition Gets IQ Boost and Broader Mobile OS Support
May 22, 2017 by audioXpress Staff

Sensory’s Fusion of Face and Voice Biometric Recognition Gets IQ Boost and Broader Mobile OS Support

Speech and vision technologies specialist Sensory announced the second major update to TrulySecure, its FIDO Certified multimodal biometric authentication technology. TrulySecure quickly, conveniently and securely recognizes enrolled users through a fusion of face and voice biometric recognition technologies in less than a second, and differentiates individuals at a 99.999% accuracy rate – all without requiring any costly and space consuming biometric scanners.
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New ams Foundry Ecosystem Provides Solutions for ASIC Design Service, Testing and Fabrication
May 22, 2017 by audioXpress Staff

New ams Foundry Ecosystem Provides Solutions for ASIC Design Service, Testing and Fabrication

Sensor solutions provider ams announced a further expansion of its Foundry Ecosystem. In cooperation with Fraunhofer IIS and RoodMicrotec, these three partners now open an additional reliable and comprehensive path towards ASIC solutions by offering IC development, assembly, test and qualification services to OEMs, system integrators and innovative start-ups, enabling them to get their ASIC solutions to market faster.
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miniDSP Introduces UMA-8 USB Microphone Array for Voice-Activated Applications
May 18, 2017 by audioXpress Staff

miniDSP Introduces UMA-8 USB Microphone Array for Voice-Activated Applications

The new miniDSP UMA-8 is a high-performance yet low cost multichannel USB microphone array built around XMOS multicore technology, designed for voice-recognition application development. Seven high-performance MEMS microphones are configured in a circular arrangement to provide high-quality voice capture for a wide range of applications. Leveraging the onboard DSP processing, the UMA-8 supports voice algorithms including beamforming, noise reduction, acoustic echo cancellation and de-reverb.
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A New Dual Discrete Op-Amp for Audio Products from Orange Amplification
April 21, 2017 by audioXpress Staff

A New Dual Discrete Op-Amp for Audio Products from Orange Amplification

Once in a while, British guitar amp specialists - increasingly turning also into a lifestyle brand - surprise the industry with some unusual products. We've seen Orange introducing headphones, the VT1000 valve/tube tester and even an automatic bias adjustment kit, the DIVO OV4. But now, Orange truly surprised us, with the introduction of its new Dual Discrete Op-Amp, which has been specifically designed for audio use. Orange simply says, "it is one of the most musically sounding of its kind on the market today."
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New CP2615 USB-to-I2S Bridge Chip from Silicon Labs for Simple Digital Audio Designs
April 21, 2017 by audioXpress Staff

New CP2615 USB-to-I2S Bridge Chip from Silicon Labs for Simple Digital Audio Designs

Silicon Labs has introduced a fixed-function audio bridge device that provides a simple, turnkey solution for transferring digital audio data between the universal serial bus (USB) and integrated inter-IC sound (I2S) serial bus interfaces. The new CP2615 digital audio bridge simplifies USB-to-I2S connectivity and accelerates time to market for a wide range of power-sensitive, space-constrained USB audio applications based on Android, Windows, Linux and Mac operating systems, including headphones, headsets, speakers, and others.
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