All items tagged with product development (903)

New Synaptics and NXP Alexa Development Kit Available at Arrow Electronics

November 1, 2017 by audioXpress Staff

New Synaptics and NXP Alexa Development Kit Available at Arrow Electronics

NXP has teamed up with Arrow Electronics, Synaptics and Amazon to develop the Synaptics AudioSmart 2-Mic and NXP Pico i.MX7Dual Development Kit for Amazon Alexa Voice Service (AVS). This newly available development kit is one of the first to be qualified with production-ready system-on-chip (SoC), voice processor, and the AVS Device SDK. It enables device makers to quickly and cost-effectively integrate Alexa into a fully functioning prototype and then take that work into design for manufacturing and production.

TDK InvenSense MEMS Microphones Available with Synaptics AudioSmart Solution

November 1, 2017 by audioXpress Staff

TDK InvenSense MEMS Microphones Available with Synaptics AudioSmart Solution

TDK Corporation showcased a Synaptics AudioSmart solution for voice recognition, using InvenSense high performance MEMS microphones. The ICS-40212 and ICS-40720 analog output and the ICS-41350 PDM digital output MEMS microphones are approved for use with Synaptics AudioSmart Amazon Voice Services (AVS) solution. TDK also announced the worldwide availability of its SmartMotion Platform encompassing 4 unique development kits with multiple sensors.

CEVA and Cyberon Partner for Ultra-low Power Always-listening Voice Activation Solution

October 30, 2017 by audioXpress Staff

CEVA and Cyberon Partner for Ultra-low Power Always-listening Voice Activation Solution

CEVA, a leading licensor of signal processing IP for smarter, connected devices, and Taiwan's leading embedded speech solution provider, Cyberon Corporation, announced a partnership to offer an ultra-low power, always-listening voice activation solution for smartphones, consumer and IoT devices. Cyberon has developed an optimized implementation of its CSpotter voice recognition engine for the CEVA-TeakLite family of DSPs.

Microchip Updates MPLAB Mindi Analog Simulator to Include Over 300 Device Models and Schematics

October 20, 2017 by Cristina Costa

Microchip Updates MPLAB Mindi Analog Simulator to Include Over 300 Device Models and Schematics

Microchip Technology announced availability of its updated MPLAB Mindi analog simulation software, now including more models and features. The circuit simulation tool now supports more than 300 Microchip analog products, with SIMetrix’s enhanced SPICE (Simulation Program with Integrated Circuit Emphasis) and SIMPLIS Technologies’ SIMPLIS (SIMulation of Piecewise LInear Systems) simulation environments.

Knowles Announces The World’s First Context-Aware, Machine Learning Optimized Audio Processor For Complex Voice Interactions

October 17, 2017 by audioXpress Staff

Knowles Announces The World’s First Context-Aware, Machine Learning Optimized Audio Processor For Complex Voice Interactions

Knowles announced a new audio processor platform, the IA8508 open DSP platform, with four high performance, power efficient, heterogeneous cores and 5.7MB of shared memory for a variety of new use cases. The IA8508 advanced audio processor is optimized for performance and power in both near and far-field voice applications – making it the perfect solution for mobile phones, ear-worn products, and IoT devices such as digital assistants, smart speakers and TVs.

Knowles Introduces Analog MEMS Microphone with 70 dB SNR for Voice and ANC Applications

October 13, 2017 by audioXpress Staff

Knowles Introduces Analog MEMS Microphone with 70 dB SNR for Voice and ANC Applications

Knowles continues to expand its audio input technology product portfolio, as voice increasingly becomes the primary user interface for Internet of Things (IoT) devices and hearable applications. The company announced its new SPM0687LR5H-1 analog MEMS microphone with 70 dB Signal-to-Noise (SNR), for far-field connected audio solutions, such as voice recognition, and active noise cancelling (ANC) headphone applications.

Sierra Wireless Announces the Most Secure Wi-Fi and Bluetooth Combo Module with Integrated Cloud Services

October 13, 2017 by audioXpress Staff

Sierra Wireless Announces the Most Secure Wi-Fi and Bluetooth Combo Module with Integrated Cloud Services

Sierra Wireless announced the BX Series Wi-Fi and Bluetooth combo modules with built-in cloud services and security features. With Wi-Fi and Bluetooth support on a single common flexible form factor (CF3) module, the BX Series provides manufacturers the flexibility to migrate between short-range and cellular technologies, as well as future-proof their product designs, optimized for connected applications.

Toshiba Expands U-MOS IX-H MOSFET Family with 40V N-Channel Devices

October 13, 2017 by audioXpress Staff

Toshiba Expands U-MOS IX-H MOSFET Family with 40V N-Channel Devices

Toshiba America Electronic Components, announced the addition of two new N-channel devices to its U-MOS IX-H family of high-efficiency, high-speed switching MOSFETs. Delivering best-in-class efficiency across a range of load conditions, Toshiba’s new MOSFETs feature U-MOS IX-H technology, which ensures stable operation also over a wide range of temperatures.

Infineon High SNR MEMS Microphones Complement Amazon AVS Far-Field Development Kit from XMOS

October 9, 2017 by audioXpress Staff

Infineon High SNR MEMS Microphones Complement Amazon AVS Far-Field Development Kit from XMOS

XMOS' VocalFusion 4-Mic Dev Kit for Amazon Alexa Voice Service (AVS) for far-field applications integrates Infineon’s high SNR MEMS microphones to ensure highest performance and reliability, creating the first Amazon AVS development kit with a linear mic array for far-field applications. The 4-Mic Development Kit features crystal clear voice capturing even in noisy environments. This enables commands to be accurately captured from across the room for processing by the Alexa cloud-based speech recognition system.

Synopsys Delivers Industry's First USB 3.2 Verification IP and Test Suite for Higher Performance USB Designs

October 6, 2017 by audioXpress Staff

Synopsys Delivers Industry's First USB 3.2 Verification IP and Test Suite for Higher Performance USB Designs

Synopsys announced the availability of the industry's first verification IP (VIP) and UVM source code test suite to support the latest USB 3.2 specification. USB 3.2 enables new hosts and devices with USB Type-C to be designed as multi-lane solutions, allowing for up to two lanes of 5 Gbps or two lanes of 10 Gbps operation, doubling the data rate over the existing USB Type-C cables. It also supports re-timer enhancements.

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