All items tagged with product development (903)
CEVA Extends its IP Platforms for Bluetooth 5 and Wi-Fi Applications with RISC-V
February 27, 2018 by Joao Martins

CEVA Extends its IP Platforms for Bluetooth 5 and Wi-Fi Applications with RISC-V

Audio and voice signal processing specialists CEVA announced that the complete RivieraWaves suite of Bluetooth 5 (low energy and dual mode) and Wi-Fi 802.11a/b/g/n/ac/ax intellectual property (IP) platforms are now offered with an optional integrated open-source RISC-V MCU. These integration-ready system solutions are ideal for those manufacturers seeking freedom from standard 3rd party processor architectures.
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STMicroelectronics Introduces Next-Generation Wireless Platform for Higher-Performing Bluetooth Devices
February 23, 2018 by Joao Martins

STMicroelectronics Introduces Next-Generation Wireless Platform for Higher-Performing Bluetooth Devices

Powering the next generation of smart connected objects like digital-home products and wearable electronics, STMicroelectronics has revealed an advanced dual-processor wireless chip that supports new features and enhanced performance with extended battery life. The fusion of 32-bit ultra-low-power microcontroller and highly integrated Bluetooth 5 (BLE) and IEEE 802.15.4 radio creates a high-performing wireless platform for feature-rich smart connected objects.
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Speakers and Voice Development - A Conversation with NXP
February 22, 2018 by Joao Martins

Speakers and Voice Development - A Conversation with NXP

After reviewing my notes from CES 2018 and the announcements from NXP, I decided it was fitting to share some parts of my interview with Martyn Humphries, vice president and general manager Media IoT and i.MX Applications Processors at NXP (and former Freescale executive). Basically, we discussed the environment that lead NXP to create its i.MX 8M single-chip media application processors, currently the most advanced integrated platform available for audio manufacturers.
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Qualcomm Enhances Performance of Truly Wireless Earbuds and Hearables with its Next Generation Qualcomm TrueWireless Stereo Technology
February 21, 2018 by audioXpress Staff

Qualcomm Enhances Performance of Truly Wireless Earbuds and Hearables with its Next Generation Qualcomm TrueWireless Stereo Technology

Qualcomm was an early pioneer in the concept of true wireless stereo a technology that is designed to completely eliminate the need for wires, not only between the media source and the headphones, but also between the left and right earbuds, offering users a wire-free stereo audio experience and supporting new use cases like hearables. Now Qualcomm announced enhancements to its Qualcomm TrueWireless Stereo technology.
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Lattice Wants Manufacturers to Replace USB Connectors with its SiBEAM Snap 12 Gbps Wireless Technology
February 21, 2018 by Joao Martins

Lattice Wants Manufacturers to Replace USB Connectors with its SiBEAM Snap 12 Gbps Wireless Technology

Lattice Semiconductor announced the expansion of its Lattice Snap wireless connector product family to support broader adoption of 60 GHz wireless technology in consumer and embedded applications. The solution allows direct replacing of physical interfaces such as USB and HDMI in consumer devices using short-range wireless technology, allowing waterproof, thinner products that are less prone to mechanical failures.
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Efficient Linux Designs with Microchip Microprocessor-Based System on Module (SOM) featuring SAMA5D2 MPU
February 21, 2018 by audioXpress Staff

Efficient Linux Designs with Microchip Microprocessor-Based System on Module (SOM) featuring SAMA5D2 MPU

Microchip Technology has unveiled a new System on Module (SOM) featuring the SAMA5D2 MPU. The ATSAMA5D27-SOM1 contains the recently released ATSAMA5D27C-D1G-CU System in Package (SiP). The SOM simplifies IoT design by integrating the power management, non-volatile boot memory, Ethernet PHY and high-speed DDR2 memory onto a small, single-sided Printed Circuit Board (PCB).
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OCA Alliance Demonstrates Expanding AES70 Interoperability at ISE 2018
February 8, 2018 by Joao Martins

OCA Alliance Demonstrates Expanding AES70 Interoperability at ISE 2018

The OCA Alliance is demonstrating the very latest developments in the AES70 standard and the technologies supporting it, at ISE 2018. Alliance member companies Archwave, Bosch, d&b audiotechnik GmbH, DeusO, Focusrite, Suzhou Fitcan Technology and Your Audio Systems GmbH are exhibiting numerous products and development tools to demonstrate the multiple facets of AES70 in a hands-on environment.
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XMOS Showcases Advanced True Stereo Voice Interface Solutions
February 1, 2018 by Joao Martins

XMOS Showcases Advanced True Stereo Voice Interface Solutions

XMOS will be showcasing their portfolio of far-field voice capture solutions for voice-enabled stereo smart TVs, soundbars, set-top boxes, and digital media adapter markets at GSMA Mobile World Congress 2018, Barcelona, 26th February to 1st March. XMOS will be demonstrating commercial solutions in development, and proof of concepts that capture voice commands accurately from across the room even when the audio appliances are playing content at high volume in complex noisy acoustic environments.
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Valens Adds New HDBaseT Chipsets to the Colligo Family for Plug-and-Play Product Design
February 1, 2018 by audioXpress Staff

Valens Adds New HDBaseT Chipsets to the Colligo Family for Plug-and-Play Product Design

Valens, the developer of HDBaseT and founder of the HDBaseT Alliance, announced the availability of the VS200 and VS210 chipsets, for simpler HDBaseT installations where not all 5Play features are necessary. The addition of the VS200 and VS210 to the Valens Colligo family allows HDBaseT equipment vendors to design and manufacture a range of products, from high-end to low-end, using a common hardware platform.
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Your Audio Systems Launches Software Development Solution for AES67 and AES70 Embedded Devices at ISE 2018
January 31, 2018 by audioXpress Staff

Your Audio Systems Launches Software Development Solution for AES67 and AES70 Embedded Devices at ISE 2018

In preparation for its Integrated Systems Europe debut, Swiss-based Your Audio Systems announces the first major demonstration of Orchestra, an embedded Linux software solution for AES67/AES70 professional embedded devices, now available for OEM implementations. The company will exhibit Orchestra in the OCA Alliance stand (7-R240) in the Amsterdam RAI, Amsterdam, from February 6-9.
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