All items tagged with product development (903)
New Qualcomm QCC3026 Bluetooth Audio System-on-Chip Now Available
June 29, 2018 by audioXpress Staff

New Qualcomm QCC3026 Bluetooth Audio System-on-Chip Now Available

Qualcomm announced the QCC3026, a flash-programmable Bluetooth Audio System-on-Chip (SoC) that is designed to reduce power consumption by up to 50% compared to previous generation entry-level flash devices. The new SoC is also engineered to help manufacturers simply and quickly develop and commercialize feature optimized truly wireless headsets, and extends the Company’s portfolio of low power Bluetooth audio solutions following the announcement of the flagship QCC5100 Bluetooth SoC series earlier this year.
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DSP Group Announces Ultra-Low-Power Development Kit with Far-Field Speech Accuracy for Amazon Alexa Voice Service
June 29, 2018 by audioXpress Staff

DSP Group Announces Ultra-Low-Power Development Kit with Far-Field Speech Accuracy for Amazon Alexa Voice Service

Wireless communications chipset solutions specialists DSP Group announced the availability of its HDClear 3-Microphone Development Kit for Amazon Alexa Voice Service (AVS). This Alexa certified solution features DBMD5, DSP Group’s advanced audio/voice processor, and its best-in-class HDClear voice enhancement processing technology, creating a complete development platform for low-power applications, including smart speakers, wearable computing devices, smart home devices and remote controls.
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Aaware and Infineon Form Partnership to Develop Next-Generation Voice Solutions
June 27, 2018 by audioXpress Staff

Aaware and Infineon Form Partnership to Develop Next-Generation Voice Solutions

Infineon Technologies, and Aaware, Inc., an emerging supplier of sound capture technology for far-field, voice-enabled digital products, announced the formation of a partnership to launch a next-generation voice development platform to be released later this summer. Aaware’s Acoustically Aware technology is highly synergistic with Infineon’s digital MEMS microphone technology, combining to bring the best sound capture for extremely noisy environments in commercial and industrial applications.
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Microchip Announces First 32-bit Low-Power MCU to Feature Robust, Chip-Level Security and Arm TrustZone Technology
June 26, 2018 by audioXpress Staff

Microchip Announces First 32-bit Low-Power MCU to Feature Robust, Chip-Level Security and Arm TrustZone Technology

Microchip announced the 32-bit SAM L10/L11 MCU families for low power and high security, based on the Arm Cortex-M23 core, with the SAM L11 featuring Arm TrustZone for Armv8-M, a programmable environment that provides hardware isolation between certified libraries, IP and application code. The SAM L11 features robust security with chip-level tamper resistance, secure boot and secure key storage. When combined with TrustZone technology, this is designed to protect applications from both remote and physical attacks.
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Fraunhofer’s xHE-AAC Audio Codec Software Extends Native AAC Support In Android P For Better Quality At Low Bitrates
June 11, 2018 by Joao Martins

Fraunhofer’s xHE-AAC Audio Codec Software Extends Native AAC Support In Android P For Better Quality At Low Bitrates

With the release of the Android P beta 3 preview, Fraunhofer IIS announces a new version of the popular FDK library which has been a part of Android since 2012. The FDK2 version will bring several new technologies to Android OEMs, service providers and developers, including xHE-AAC for video and music delivery down to 12kbit/s for stereo sound and MPEG-D DRC dynamic range control for better listening in noisy environments. An important update for a very fragmented platform.
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AKM Releases AK1574 Fractional-N PLL Synthesizer with VCO Capable to Replace Variable Capacitance Diode Configurations
June 11, 2018 by audioXpress Staff

AKM Releases AK1574 Fractional-N PLL Synthesizer with VCO Capable to Replace Variable Capacitance Diode Configurations

Asahi Kasei Microdevices Corporation (AKM) launched the AK1574, a fractional-N PLL synthesizer with a Voltage Controlled Oscillator (VCO) for frequency modulation, able to replace variable capacitance diode configurations. Targeting professional, portable, radio transmission systems, the built-in VCO supports from 46.875 to 1682.5MHz, saves space, has low-phase noise, and low-power consumption. Uses include two-way radios in the VCO configuration with a variable capacitance diode and a winding coil, with support for diversity receivers.
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Microchip Increases System Performance in Closed-loop Control Applications with New PIC and AVR MCUs
June 8, 2018 by audioXpress Staff

Microchip Increases System Performance in Closed-loop Control Applications with New PIC and AVR MCUs

Advancements in the architecture of PIC and AVR 8-bit microcontrollers (MCUs) have optimized the devices for implementing closed-loop control, enabling systems to offload the Central Processing Unit (CPU) to manage more tasks and save power. To help designers maximize performance and efficiency in these systems, Microchip Technology introduced the new PIC18 Q10 and ATtiny1607 families, featuring multiple intelligent Core Independent Peripherals (CIPs) that simplify development and enable quick response time to system events.
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Cypress USB-C Power Delivery Controller Now Available for Use in Thunderbolt 3 Designs
June 6, 2018 by audioXpress Staff

Cypress USB-C Power Delivery Controller Now Available for Use in Thunderbolt 3 Designs

Cypress Semiconductor announced that its programmable, EZ-PD CCG5 two-port USB-C controller with Power Delivery (PD) has now been qualified by Intel for use in Thunderbolt 3 host and peripheral designs. Thunderbolt 3 over USB-C enables data transfers at speeds up to 40 Gbps via a compact port with the ability to transmit multiple protocols and provide fast device charging. Reference designs are now available to enable fast time-to-market for PCs, docking stations, hard drives and a variety of other peripherals.
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Texas Instruments Launches Three New Class-D Amplifiers to Solve Smart-Home Audio Design Challenges
June 4, 2018 by audioXpress Staff

Texas Instruments Launches Three New Class-D Amplifiers to Solve Smart-Home Audio Design Challenges

Texas Instruments (TI) introduced three new digital-input Class-D audio amplifiers that enable engineers to deliver high-resolution audio in more smart-home and voice-enabled applications. By combining first-of-its-kind integration, real-time protection and new modulation schemes, TI's new audio devices allow designers to reduce board space and overall bill of material (BOM) cost, while providing premium sound and integrated protection for applications such as smart speakers and soundbars.
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Alango and Seeed Collaborate on Voice Interface Far-Field Technology
June 1, 2018 by audioXpress Staff

Alango and Seeed Collaborate on Voice Interface Far-Field Technology

Alango announced its collaboration with Seeed Technology providing far-field voice enhancement on the Seeed ReSpeaker Core v2.0. Seeed's ReSpeaker Core v2.0 is designed as a multifunctional development board for voice interface applications. The platform is based on the Rockchip RK3229, a quad-core ARM Cortex A7, running up to 1.5GHz, with 1GB RAM. The board features a six-microphone array with Alango's Voice Enhancement Package "VEP" and is able to be customized upon request.
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