All items tagged with product development (903)

WiSA Introduces “WiSA Endorsed” Designation for Amplifiers

December 19, 2018 by audioXpress Staff

WiSA Introduces “WiSA Endorsed” Designation for Amplifiers

WiSA, the (Wireless Speaker and Audio) Association, an industry group composed of over 40 leading brands including founding member Summit Wireless Technologies, introduces "WiSA Endorsed" for audio amplifiers designed for use in today’s powered home audio speakers. This new designation coincides with the launch of member brand Infineon Technologies MERUS MA12070 4-26V ultra-efficient audio amplifier which is the first amplifier to receive the endorsement.

Snips Offers Offline Options for Voice Control and Voice Assistants to OEM's at CES 2019

December 14, 2018 by Joao Martins

Snips Offers Offline Options for Voice Control and Voice Assistants to OEM's at CES 2019

Original equipment manufacturers (OEM) interested in implementing voice control in their new products without depending on Alexa or Google Assistant should visit Snips at CES 2019. Snips.ai is a French company that provides embedded voice assistants and interfaces for connected devices that run locally and offline. This year the company won a CES 2019 Best of Innovation Awards in the Embedded Technology category and will be demonstrating its technology at CES in the Eureka Park.

Tempow Unveils New Technology for True Wireless Earbuds Compatible with Any Bluetooth Chipset

December 13, 2018 by audioXpress Staff

Tempow Unveils New Technology for True Wireless Earbuds Compatible with Any Bluetooth Chipset

As audioXpress previously anticipated, French wireless audio pioneer Tempow has been developing a new technology approach to bring next-generation True Wireless Stereo (TWS) to the Bluetooth earbud mass market. Tempow's hardware-agnostic solution lets any smartphone manufacturer create wireless earbuds with near-zero latency, increased battery, and high fidelity, in alternative to proprietary or non-standard Bluetooth solutions.

MIPI Alliance Releases I3C Basic Interface Specification for Widespread Implementation in Mobile and Beyond

December 12, 2018 by audioXpress Staff

MIPI Alliance Releases I3C Basic Interface Specification for Widespread Implementation in Mobile and Beyond

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today released MIPI I3C Basic v1.0, a subset of the MIPI I3C specification that bundles the most commonly needed I3C features for developers and other standards organizations. Released under royalty-free terms, MIPI I3C Basic provides a streamlined upgrade path from the ubiquitous I2C, with the most commonly needed developer capabilities for smartphones, IoT devices, connected vehicles and more.

SEGGER Introduces Microcontroller-Based Dual USB Development Platform

December 7, 2018 by audioXpress Staff

SEGGER Introduces Microcontroller-Based Dual USB Development Platform

SEGGER announced emPower-USB-Host, a compact low-cost development board with two USB host ports, where many applications using USB peripherals can be realized with little effort and in a cost efficient way. Precompiled applications for barcode and smartcard readers, as well as POS displays, LTE sticks, and USB to LAN adapters are available for download, including complete projects for Embedded Studio with source code of these applications. Applications using SEGGER's emUSB-Host software API can easily access different types of USB devices.

AgigA Tech Awarded Patent for Adaptive Management of Supercapacitors

December 5, 2018 by Cristina Costa

AgigA Tech Awarded Patent for Adaptive Management of Supercapacitors

AgigA Tech, a provider of high-speed, high-density, battery-free non-volatile memory solutions and a subsidiary of Cypress Semiconductor, announced the issuance of United States Patent No. 10,134,451 relating to the adaptive training and adjustment to changing capacitor values based upon age and usage behavior. The patent brings AgigA Tech’s portfolio total to 22 granted. Having focused on the development of non-volatile DIMM, or NVDIMM, and related technology for more than 10 years, many of the patents in AgigA Tech’s portfolio are fundamental to this increasingly pervasive product category.

New RISC-V SoC FPGA Architecture Supports Real-Time Linux Development

December 5, 2018 by audioXpress Staff

New RISC-V SoC FPGA Architecture Supports Real-Time Linux Development

Microchip Technology, via its Microsemi Corporation subsidiary, extended its Mi-V ecosystem by unveiling the architecture for a new class of SoC FPGAs that combine the industry's lowest power mid-range PolarFire FPGA family with a complete microprocessor subsystem based on the open, royalty-free RISC-V instruction set architecture (ISA). Demonstrations took place during RISC-V Summit (Dec. 4-5) to show size, power and performance benefits of integrating PolarFire SoC's Hard CPU Subsystem with Programmable Logic.

Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds

November 29, 2018 by audioXpress Staff

Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds

CEVA, the leading licensor of signal processing platforms for connected devices, along with French wireless audio pioneer Tempow, unveiled a collaboration to bring next-generation True Wireless Stereo (TWS) to the Bluetooth earbud mass market. As mentioned in a recent article by CEVA's Marketing Director, Franz Dugand, the resulting joint IP solution delivers synchronized left/right audio over standard Bluetooth dual mode connected links with short latency and without the power consumption penalty associated with many of today’s TWS implementations.

Sonova Announces SWORD 3.0 Wireless Chip for Hearing Aids with CEVA Bluetooth IP

November 27, 2018 by audioXpress Staff

Sonova Announces SWORD 3.0 Wireless Chip for Hearing Aids with CEVA Bluetooth IP

CEVA announced that Sonova Holding AG, a leading provider of hearing solutions, has licensed and deployed CEVA’s RivieraWaves Bluetooth IP in its latest SWORD 3.0 wireless chip for hearing aids and other smart hearing devices. The latest generation wireless chip leverages RivieraWaves’ Bluetooth dual mode IP and Sonova’s ultra-low power communication technology to enable true stereo audio streaming to hearing aids.

Renesas Extreme Low-Power SOTB Process Technology Uses Energy Harvesting and Very Low Current Levels to Power Connected Devices

November 16, 2018 by Cristina Costa

Renesas Extreme Low-Power SOTB Process Technology Uses Energy Harvesting and Very Low Current Levels to Power Connected Devices

Renesas Electronics unveiled an innovative energy-harvesting embedded controller that can eliminate the need to use or replace batteries in connected devices. Developed based on Renesas' breakthrough SOTB (silicon-on-thin-buried-oxide) process technology, the new embedded controller achieves extreme reduction in both active and standby current consumption, a combination that was not previously possible to achieve in conventional microcontrollers (MCUs).

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