All items tagged with product development (903)
Skyworks Powers Wireless Audio Connectivity Applications on Sonos New Amp
January 17, 2019 by audioXpress Staff

Skyworks Powers Wireless Audio Connectivity Applications on Sonos New Amp

Skyworks Solutions announced that its wireless engines are delivering connectivity in Sonos’ new versatile digital amplifier, the Amp. Specifically, Sonos is leveraging several of Skyworks’ front-end solutions to facilitate robust Wi-Fi communications allowing users to effortlessly transmit high-quality sound throughout the home with their mobile phones. With the surge in connected devices across the Internet of Things (IoT), wireless capability has become the critical link for many applications.
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Turning Up the Innovation on Smart Speaker Designs
January 16, 2019 by Benwei Xin and Wenchau Albert Lo

Turning Up the Innovation on Smart Speaker Designs

For its December 2018 edition, audioXpress compiled a Voice Market Update that explores some of the latest developments and platforms for voice processing, with contributed articles from world-renowned experts in voice. In this article, Benwei Xin and Wenchau Albert Lo explain where designers should focus to Turn Up the Innovation on Smart Speaker Designs. This article was originally published in audioxpress, December 2018.
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Analogix Announces Second Generation ANX74xx Family of 10 Gbps USB 3.2 Single-Chip Re-Timers
January 14, 2019 by Cristina Costa

Analogix Announces Second Generation ANX74xx Family of 10 Gbps USB 3.2 Single-Chip Re-Timers

Analogix Semiconductor announced the availability of its second generation ANX74xx family of 10 Gbps USB-C re-timers capable of switching DisplayPort and USB 3.2 Gen2 signals to support a single USB-C port for next generation high-performance, low-power notebooks, 2-in-1 convertible laptops, desktop PCs, mobile devices, and servers. Built on a market proven architecture, the ANX74xx family complies with USB Repeater Specification for USB Gen 1 (5G) and Gen 2 (10G).
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Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options
January 10, 2019 by audioXpress Staff

Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options

Microchip Technology, via its Microsemi Corporation subsidiary, announced that its AcuEdge ZLK38AVS Development Kit for Amazon Alexa Voice Service (AVS) now introduces far-field voice pick up and the flexibility to build devices with multiple mic array configurations. The audio front-end solution with one, two and three mic configurations reduces bill of materials costs while addressing the requirements of small-form-factor designs.
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ESS Technology Introduces Suite of High-Quality USB-C Audio CODECs Featuring Sabre DACs
January 4, 2019 by audioXpress Staff

ESS Technology Introduces Suite of High-Quality USB-C Audio CODECs Featuring Sabre DACs

ESS Technology announced a series of USB Low-Power Audiophile CODECs that feature QUAD DAC Technology. Intended for use in headsets and audio adaptors that demand high-quality sound, the new line of CODECs can support end-to-end high-resolution audio quality. An ideal platform for USB-C audio products, the new CODECs include the flagship ES9281PRO model, which also offers an integrated hardware MQA (Master Quality Authenticated) renderer.
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CEVA Announces New CEVA-BX All-Purpose Hybrid DSP / Controller Architecture
January 4, 2019 by audioXpress Staff

CEVA Announces New CEVA-BX All-Purpose Hybrid DSP / Controller Architecture

CEVA announced its new all-purpose, hybrid DSP / Controller architecture to address new algorithms of digital signal processing in voice, video, communication, sensing and digital signal control applications. Offering general purpose DSP capabilities required for motor control and electrification, the new CEVA-BX architecture extends CEVA's market reach into the burgeoning automotive and industrial markets currently underserved by legacy DSPs or MPU/MCUs with low performance DSP co-processing.
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Universal Electronics and Microsoft Collaborate on a Turnkey Digital Assistant Platform for Smart Home Hub
January 4, 2019 by audioXpress Staff

Universal Electronics and Microsoft Collaborate on a Turnkey Digital Assistant Platform for Smart Home Hub

Universal Electronics (UEI), a company specializing in universal control and sensing technologies for the smart home, announced a collaboration with Microsoft to launch a new digital assistant platform for the home built on the Microsoft Azure cloud platform using AI and IoT services. The UEI’s Nevo Butler turnkey smart home hub with nevo.ai built-in digital assistant will be launched at CES 2019 and will be available as a white-label solution for other manufacturers.
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Optek Licenses and Deploys CEVA Bluetooth IP for Next-Generation Bluetooth 5 Wireless Audio Applications
January 2, 2019 by audioXpress Staff

Optek Licenses and Deploys CEVA Bluetooth IP for Next-Generation Bluetooth 5 Wireless Audio Applications

CEVA, a leading licensor of signal processing platforms and artificial intelligence processors for connected devices, announced that Optek Digital Technology, a fabless semiconductor company of advanced multimedia SoCs, has licensed and deployed CEVA’s RivieraWaves Bluetooth 5 Dual Mode IP in its latest OTK528X multimedia System-on-Chip (SoC), targeting artificial intelligence (AI), voice and music market segments and applications including hearables, wireless speakers, on/in ear headphone, multi-channel AVR, musical instruments and voice user interface (VUI).
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Voice Coil January 2019 is Here and Ready for Another Year!
December 28, 2018 by audioXpress Staff

Voice Coil January 2019 is Here and Ready for Another Year!

Voice Coil January 2019 is now available. This edition focuses on New Materials for Earphones and Headphones and also includes a valuable listing of Earphone and Headphone Manufacturers and a schedule of headphone-centric events for the year. In Acoustic Patents, James Croft looks at a new patent of a multilayer voice coil plate and flat speaker based on the same, while in this month's Test Bench Vance Dickason features a 1" compression driver from Radian Audio Engineering, and a 1" soft dome tweeter from Eminence. This is much more, now available in print and download.
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Airgain Collaborates with Quantenna on New Wi-Fi 6 Reference Design
December 20, 2018 by audioXpress Staff

Airgain Collaborates with Quantenna on New Wi-Fi 6 Reference Design

Airgain, a leading provider of advanced antenna technologies, announced the development of a Wi-Fi 6 reference design with Quantenna Communications. The new design will enable swift development of high performance IEEE 802.11ax (Wi-Fi 6) devices incorporating Airgain’s Wi-Fi 6 antenna solution and Quantenna’s high-performance Wi-Fi 6 chipset, the QSR10GU-AX PLUS.
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