All items tagged with product development (903)
DesignSpark Engineering Community Surpasses 750,000 Members
February 21, 2019 by audioXpress Staff

DesignSpark Engineering Community Surpasses 750,000 Members

RS Components (RS), the trading brand of Electrocomponents plc, a global multi-channel provider of industrial and electronic products and solutions, and Allied Electronics & Automation multi-channel industrial distributor in the Americas, announced that its DesignSpark online engineering community has grown to more than 750,000 members. The DesignSpark family of free tools for electrical, PCB, mechanical design, and connectivity software are a valuable resource for product development and its popularity continues to grow.
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Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%
February 20, 2019 by audioXpress Staff

Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%

Nanusens, a research venture working on nano-sensors built inside CMOS devices, has announced that its proprietary technology can significantly increase the operational life of earbuds by up to 20%. This can be achieved by replacing the MEMS sensors in an earbud with a single multi-sensor chip solution that is up to ten times smaller, freeing up space for larger batteries. The company will be announcing this technology solution at MWC 2019 in Barcelona, Spain.
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Cirrus Logic Introduces Industry’s Smallest, Low-Power Boosted Smart Audio Amplifier to Support Global Shift to Mobile Stereo
February 19, 2019 by audioXpress Staff

Cirrus Logic Introduces Industry’s Smallest, Low-Power Boosted Smart Audio Amplifier to Support Global Shift to Mobile Stereo

To support the growing trend toward stereo audio in smartphones and portable devices, Cirrus Logic announced the new Cirrus Logic CS35L41 boosted smart power amplifier, based on 55nm process design. The new Class D amp delivers on the “big three” OEM requirements for mobile applications: enriched audio sound, efficient low-power management and a space-saving package. Featuring predictive algorithms, the power amp increases the audio volume when in speakerphone mode, while reducing noise and power consumption.
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NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution
February 18, 2019 by audioXpress Staff

NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution

Following a showcase at CES 2019, NXP Semiconductors announced its Immersiv3D audio solution, combining NXP software on its i.MX 8M Mini applications processor with support both Dolby Atmos and DTS:X immersive audio technologies. The i.MX 8M Mini SoC also brings smart capabilities like voice control to a broader range of consumer devices including soundbars, smart speakers, and AV receivers with the option for adding additional speakers to distribute smart voice control and immersive audio throughout the home.
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DECT Forum Introduces openD for Wireless Software Development
February 14, 2019 by audioXpress Staff

DECT Forum Introduces openD for Wireless Software Development

DECT Forum, the worldwide association focused on promoting the wireless home and enterprise communication industry, announced the market launch of openD, a new platform for software development using the DECT air interface for wireless applications. The launch conference will take place in Nuremberg, Fraunhofer IIS, on February 25, 2019. The initiative marks an important moment for wireless developers as the strengths of DECT and ULE (Ultra Low Energy) will become more accessible to developers and product managers alike.
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Libre Wireless MAVID Device and Software Now with Amazon Alexa Built-in
February 8, 2019 by audioXpress Staff

Libre Wireless MAVID Device and Software Now with Amazon Alexa Built-in

Leading embedded wireless voice/AI solutions provider Libre Wireless Technologies announced that its MAVID (Multiprotocol, Audio, Voice, IoT Device) super compact, ultra-low power mic-to-cloud platform and software SDK, now supports the Alexa Voice Service (AVS) built-in. The breakthrough platform incorporates a complete hardware and software solution for embedded voice, IoT, audio and wireless connectivity, and now features integrated AVS.
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OCA Alliance Promotes AES70 Control Standard Upgrade at ISE 2019
February 1, 2019 by audioXpress Staff

OCA Alliance Promotes AES70 Control Standard Upgrade at ISE 2019

The OCA Alliance – the AV trade association formed to promote awareness, implementation and development of the AES70 open network control standard – has announced the release of the latest revision of the AES70-2018 standard with new developer tools and resources, making implementation “easier than ever before”. The result of several years of collaborative work within the OCA Alliance and the AES, AES70-2018 is an evolutionary upgrade to the original AES70-2015 standard.
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CEVA Announces Availability of RivieraWaves Bluetooth 5.1 IP
January 30, 2019 by audioXpress Staff

CEVA Announces Availability of RivieraWaves Bluetooth 5.1 IP

CEVA announced the general release of its RivieraWaves Bluetooth 5.1 IP and multiple license agreements already signed with leading semiconductor companies. Supporting the headline new feature of Direction Finding via Angle of Arrival (AoA) and Angle of Departure (AoD) for enhanced location services, the RW-Bluetooth 5.1 IP is available in both Bluetooth Dual Mode and Bluetooth Low Energy flavors.
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CEVA Introduces WhisPro, Neural Network-Based Speech Recognition Technology For Voice Assistants and Connected Devices
January 17, 2019 by audioXpress Staff

CEVA Introduces WhisPro, Neural Network-Based Speech Recognition Technology For Voice Assistants and Connected Devices

During CES 2019, CEVA, a leading licensor of signal processing platforms and artificial intelligence processors, introduced WhisPro, a Neural Network based speech recognition technology targeting the rapidly growing use of voice as a primary human interface for intelligent cloud-based services and edge devices. WhisPro provides Trigger Phrase SDKit for always-on devices, extending CEVA's intelligent sound IP portfolio, and offering developers a holistic solution for cloud-based or edge voice-controlled devices.
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Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC
January 17, 2019 by audioXpress Staff

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

Cadence Design Systems announced that Optek has selected the Cadence Tensilica HiFi 3 DSP for its latest OTK528X Bluetooth 5 dual-mode audio/voice system on chip (SoC). Optek’s customers can now take advantage of the HiFi DSP ecosystem for optimized audio, voice and artificial intelligence (AI) speech-based recognition processing software utilized in applications including hearables, wireless speakers, soundbars, on/in ear headphones, multi-channel AVRs, musical instruments, and voice user interface (VUI) devices.
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