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Industry’s First Automotive USB 3.1 SmartHub with Type-C Support Enables 10x Faster Data Rates in Infotainment Systems
by audioXpress Staff

Industry’s First Automotive USB 3.1 SmartHub with Type-C Support Enables 10x Faster Data Rates in Infotainment Systems

As firmware updates and larger media files become more prevalent in automotive entertainment consoles, faster data rates are required to reduce upload and download times. Microchip Technology announced an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in the smartphone market and enable universal connectivity in vehicles, the USB7002 SmartHub IC includes interfaces for USB Type-C connectors.
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GORE MEMS Protective Vents Improve Yields Through the MEMS Microphone Manufacturing Process
by audioXpress Staff

GORE MEMS Protective Vents Improve Yields Through the MEMS Microphone Manufacturing Process

The latest portable electronic devices are expected to go everywhere with us and withstand anything, as soon as they leave the assembly line… but what about while they are still on the assembly line? In examining this challenging environment, W. L. Gore & Associates (Gore) developed GORE MEMS Protective Vents, designed to shield the device from extreme conditions faced during manufacturing and maximize yields.
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Dirac Research Debuts Dirac Distortion Control, Enabling Cleaner Audio From Mobile Devices at MWC19
by audioXpress Staff

Dirac Research Debuts Dirac Distortion Control, Enabling Cleaner Audio From Mobile Devices at MWC19

Dirac Research announced the debut of Dirac Distortion Control, a patent-pending audio solution that reduces audible distortion in smartphones, tablets, laptops and all-in-one PCs with minimal impact on volume. The company introduced Dirac Distortion Control to the mobile market at MWC19 in Barcelona with a demo experience developed to showcase the next-generation of mobile audio performance in partnership with leading micro-speaker manufacturer AAC Technologies.
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Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers
by audioXpress Staff

Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers

Qualcomm Technologies International, a subsidiary of Qualcomm Incorporated, showcased at MWC 2019 in Barcelona the most recent wireless earbuds and hearables using the latest Qualcomm QCC5100 and QCC302x series, ultra-low power Bluetooth audio SoCs. Now available in more than 10 products, Qualcomm is finding increased traction from audio, mobile and consumer electronics manufacturers for these SoCs, allowing for a robust, low-latency and high-quality wireless audio experiences, in compact, feature-rich wireless earbuds, headsets and speakers.
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Analog Devices Unveils New SHARC Audio Module Platform for Rapid Audio DSP Project Development
by audioXpress Staff

Analog Devices Unveils New SHARC Audio Module Platform for Rapid Audio DSP Project Development

Analog Devices announced the availability of its new SHARC Audio Module (ADZS-SC589-MINI), a hardware/software platform that facilitates efficient product prototyping, development, and production of a variety of digital audio products. Delivering an innovative combination of high-performance audio signal processing components and a comprehensive software development environment, the SHARC Audio Module is ideal for effects processors, multi-channel audio systems, MIDI synthesizers, and many other DSP-based audio projects.
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Expanded Perspectives on Loudspeaker Enclosure Materials with Voice Coil March 2019
by audioXpress Staff

Expanded Perspectives on Loudspeaker Enclosure Materials with Voice Coil March 2019

Voice Coil March 2019 is now available and this issue focuses on the vital, but seldom addressed, topic of loudspeaker enclosure materials. Mike Klasco reviews and looks ahead at all the materials and design approaches for loudspeaker enclosures, and the edition also includes a complete directory for sourcing vendors in this area. James Croft reviews a Coaxial Centerbody Point-Source (CCPS) Horn Speaker System patent, and Vance Dickason characterizes three new tweeters on Test Bench.
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Mymanu CLIK S All-In-One Truly Wireless Earbuds Unveiled at MWC 2019
by audioXpress Staff

Mymanu CLIK S All-In-One Truly Wireless Earbuds Unveiled at MWC 2019

British start-up Mymanu is determined to embrace new challenges, again, with the launch of what the company calls “the most affordable, All-In-One truly wireless earbuds” with extended features. Unveiled at MWC 2019, in Barcelona and targeted to cost 79$ on pre-order, the new Mymanu CLIK S earbuds have been designed with fitness, music and travel lovers in mind. And as with previous initiatives from Mymanu, the focus continues to be the use of TWS earbuds for language translation, supported with a connected smartphone and app.
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Bragi Offers New Technology Suite and Reference Design for Consumer and Professional Hearables
by audioXpress Staff

Bragi Offers New Technology Suite and Reference Design for Consumer and Professional Hearables

Bragi, the company which can rightfully claim to be the creators of the world’s first Hearable, is unveiling the next-generation of its technology suite and is to introduce it at MWC 2019. As previously announced, Bragi is now developing ultra-efficient artificial intelligence and edge computing technologies for ultra-low power devices that intends to make available to other manufacturers. At MWC 2019, the German company will disclose details of the new platform as a reference design for professional Hearables.
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DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture
by audioXpress Staff

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

DSP Group and Snips, the European pioneer in embedded voice recognition software, announced a technology partnership which combines Snips’ voice software with DSP Group’s Ultra Low Energy (ULE) system-on-chip (SoC) and modules. According to the announcement, this combination of software and hardware running over the ULE network extends the reach of natural voice-controlled edge devices and could become a natural choice for multi-room smart home and smart building applications.
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Analogix Introduces Second Generation 10G USB-C Re-timer for Smartphones
by Cristina Costa

Analogix Introduces Second Generation 10G USB-C Re-timer for Smartphones

Analogix Semiconductor, announced the availability of its ANX7451, second generation 10 Gbps USB-C re-timer capable of supporting USB 3.2 Gen2 data rates and DisplayPort 1.4a at 8.1 Gbps for next generation 10G mobile devices which require re-timers to drive appreciable distances. ANX7451 guarantees high bandwidth data and video transport over long channels in smartphone system boards and external cable connections.
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