audioXpress May 2024 Glass Audio Special Issue Now Available

audioXpress May 2024 Glass Audio Special Issue Now Available
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Advertise in the Loudspeaker Industry Sourcebook 2024!

Advertise in the Loudspeaker Industry Sourcebook 2024!
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Loudspeaker Knowledge and Innovation in Voice Coil April 2024

Loudspeaker Knowledge and Innovation in Voice Coil April 2024
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The Audio Voice - Weekly Newsletter for audioXpress and Voice Coil Communities

The Audio Voice - Weekly Newsletter for audioXpress and Voice Coil Communities
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Audioengine Unveils A5+ Premium Wireless Smart Speaker System
by audioXpress Staff

Audioengine Unveils A5+ Premium Wireless Smart Speaker System

Audioengine announced the A5+ Wireless Music System. Following similar design aesthetics from its other compact speakers, the Audioengine 5+ Wireless is an exciting evolution of the award-winning A5 speakers, focusing on wireless streaming, with upgraded features and the A5+ signature sound. As the company explains, "the A5+ Wireless isn’t just a pair of powered stereo speakers but a smart music system that works with Alexa, Siri, and all other voice activated apps, speakers, and devices - as well as every music app on the planet."
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Antelope Audio Announces Availability of EDGE Strip Discrete Preamp and Modeling Mic Bundle
by audioXpress Staff

Antelope Audio Announces Availability of EDGE Strip Discrete Preamp and Modeling Mic Bundle

Having turned heads and opened ears during a must-see showcase at the 2018 NAMM Show in Anaheim, high-end professional audio equipment manufacturer Antelope Audio now announced availability of the EDGE Strip bundle — comprising the EDGE modeling microphone and specifically-designed DISCRETE MP Discrete Dual Ultra-Linear Microphone Preamp. When paired, the solution offers a locker-full of vintage mics and rack-full of outboard gear for high-quality studio recordings with vintage analogue sound.
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Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems
by Joao Martins

Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems

Following earlier demonstrations at CES 2018, Qualcomm introduced a series of new platforms, SoC and development kits targeting new advanced audio applications and smart speakers, including the support of key wireless technologies, voice and cloud ecosystems. Solutions include its Smart Audio Platform optimized for smart speakers, a 6-microphone far field voice platform qualified for Amazon AVS, Dolby Audio implementations for wireless speakers and much more.
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    Sony Mobile Introduces Bold New Open-ear Wired and True Wireless Earphones
    by Joao Martins

    Sony Mobile Introduces Bold New Open-ear Wired and True Wireless Earphones

    At the Barcelona, 2018 Mobile World Congress, Sony Mobile announced its Xperia Ear Duo truly wireless concept, which should be reaching the market in Spring 2018. According to Sony, the Xperia Ear Duo was built to reimagine the wireless headset with a bold new Spatial Acoustic Conductor open-ear design, featuring notifications and environmental awareness, with Google Assistant or Siri support. A similar design is available on the Open-ear Stereo Headset STH40D wired model.
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    Sescom Attenuating Line to Mic Level Cables for 2-Volt Audio Signals
    by audioXpress Staff

    Sescom Attenuating Line to Mic Level Cables for 2-Volt Audio Signals

    Sescom, a manufacturer of professional audio transformers and interface technology from Mount Marion, N.Y., introduced a new range of attenuating line to mic level cables that provide properly matched mic level signals to popular video-recording DSLR cameras and other devices accepting mic level audio only. Available in two models, with RCA male plugs or with XLR female plugs, both models are also terminated with a 3.5mm stereo plug.
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    STMicroelectronics and USound Demonstrate MEMS Speaker Headphones at MWC 2018
    by Joao Martins

    STMicroelectronics and USound Demonstrate MEMS Speaker Headphones at MWC 2018

    Expanding on the first presentation of USound’s technology at Mobile World Congress a year ago, in 2018 STMicroelectronics hosted a working product demonstration of a in-earphone using only one single MEMS speaker driver per side, as well as a spatial audio demo using 14 drivers on over-ear headphones, proving the technology’s full potential. MEMS speakers developed by USound and manufactured by STMicroelectronics combine minuscule size, low profile, and high efficiency, enabling multiple wearable form factors.
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    Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio
    by Joao Martins

    Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio

    Global communications equipment provider Huawei has entered into a worldwide patent license agreement with the renowned developer of audio and media technologies, Fraunhofer IIS, for Fraunhofer’s MPEG-4 Audio patent portfolio. The license agreement addresses past and future use of Fraunhofer’s MPEG-4 Audio patent portfolio in Huawei’s products. The patents cover compression formats for perceptual coding of audio signals, including some variations of Advanced Audio Coding (AAC), and other audio/speech coding formats and tools.
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    TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems
    by audioXpress Staff

    TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems

    TDK Corporation announced that it has reached an agreement with Chirp Microsystems, a pioneer in high-performance ultrasonic sensing, headquartered in Berkeley, California. With the acquisition, Chirp becomes a wholly owned subsidiary of TDK, enhancing its existing technology in fingerprint sensors, MEMS sensors, and Piezoelectric transducer product lines. “TDK aims to be the leader in the ultrasonic MEMS sensors and solutions market,” says Shigenao Ishiguro, TDK’s President and CEO.
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    Social Music Platform BandLab Technologies Buys What's Left of Cakewalk
    by Joao Martins

    Social Music Platform BandLab Technologies Buys What's Left of Cakewalk

    In the middle of all the turmoil around the rumors of the collapse of Gibson Brands, there's some sort of good news for musicians and many home and project studios. Following the hard-to-understand news, back in November 2017, that Gibson was closing Cakewalk - the first clear sign that the group was facing serious financial troubles - there is now a confirmation that not everything is lost for users of Cakewalk's products. Singapore-based BandLab Technologies confirmed the acquisition of Cakewalk Inc. remaining assets.
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    CEVA Extends its IP Platforms for Bluetooth 5 and Wi-Fi Applications with RISC-V
    by Joao Martins

    CEVA Extends its IP Platforms for Bluetooth 5 and Wi-Fi Applications with RISC-V

    Audio and voice signal processing specialists CEVA announced that the complete RivieraWaves suite of Bluetooth 5 (low energy and dual mode) and Wi-Fi 802.11a/b/g/n/ac/ax intellectual property (IP) platforms are now offered with an optional integrated open-source RISC-V MCU. These integration-ready system solutions are ideal for those manufacturers seeking freedom from standard 3rd party processor architectures.
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